Image Sensors: Soitec STMicroelectronics agreement

STMicroelectronics and Soitec have started an exclusive joint cooperation that will lead to the development of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products.

The resolution of today’s leading-edge image sensors is continuously increasing, while demand is high for the overall reduction of the camera-module footprint, particularly in consumer markets. This means the necessary development of smaller individual pixel sizes, while maintaining pixel sensitivity to produce high-quality images. Backside illumination is a key enabling technology to meet this challenge in the development of next-generation image sensors.

The agreement between the two companies includes the licensing by Soitec to ST of the Smart Stacking™ bonding technology for the manufacturing of backside-illumination sensors on 300mm wafers. This technology, developed by Soitec’s Tracit business unit, leverages molecular bonding, and mechanical, as well as chemical thinning. ST will develop a new generation of image sensors based on its advanced derivative-CMOS process technology at 65nm and beyond, at its 300mm facility in Crolles, France. In combination with ST’s advanced wafer-level manufacturing capabilities, the Smart Stacking technology will enable ST to increase its leadership in developing and supplying high-performance image sensors for mobile consumer products.

“Backside illumination technology is a key ingredient in the small-pixel, high-image-quality race for the development of leading-edge image sensors,” said Eric Aussedat, Group Vice President and General Manager, Imaging Division, STMicroelectronics. “Partnering with Soitec will help quickly deploy the Smart Stacking technology into ST’s camera products. This agreement will accelerate the development of advanced and superior cost-competitive image-sensor processes, and further confirms the Grenoble region as a world-class center of expertise for advanced CMOS imaging technologies.”

“We are very pleased that STMicroelectronics has chosen our Smart Stacking technology for their BSI product,” said André-Jacques Auberton-Hervé, chairman and president of the Soitec Group. “This technology developed by our Tracit business unit, supports fast implementation of advanced processes involving substrate engineering and 3D integration. We are glad to support ST’s commitment to innovation for the benefit of their customers.”

About Soitec Group About STMicroelectronics

Four Thirds System Digital SLR Camera Standard: Olympus and Kodak Agreement

Olympus and Kodak Agree to Implement Four Thirds System Digital SLR Camera Standard

Olympus Optical Co., Ltd. of Japan and Eastman Kodak Company of the United States recently announced that they have agreed to implement the Four Thirds System (4/3 System), a new standard for next-generation digital SLR camera systems that will ensure interchangeable lens mount compatibility. The two companies have resolved to aggressively implement this new standard in their respective product lines, and to establish the Universal Digital Interchangeable Lens System Forum, an industry forum that will promote acceptance of the Four Thirds System by other camera manufacturers. Fuji Photo Film Co., Ltd. has already agreed to participate in the new standard.

About Four Thirds System

The Four Thirds System is not based on existing standards for 35mm film SLR camera system lenses, but instead establishes a new common standard for the interchange of lenses developed exclusively to meet the optical design requirements of digital SLR cameras.

4/3-Inch (Type) Image Sensor Size

The Four Thirds System uses a 4/3-type CCD, CMOS or other image sensor, and will facilitate the development of dedicated digital camera lens systems that maximize image sensor performance and ensure outstanding image quality while also being smaller and easier to handle than 35mm film SLR camera lens systems.

Lens Mount Standardization

By establishing an open standard for camera body and lens mounts, the new system will make it possible to standardize lens mounting systems, something that has been impossible to achieve with digital SLR cameras that are based on existing 35mm film SLR lens systems. In addition, the new system defines standards for image circle size (the diameter of the area in which the subject is resolved) and back focus distance (the distance from the lens mount to the image sensor).

Development Background

Current digital SLR cameras with interchangeable lenses are basically based on conventional 35mm camera systems. As a result, they must be equipped with image sensors that are comparable in size to 35mm and APS film. However, because the imaging characteristics of these large CCDs are fundamentally different from those of film, a number of issues can prevent them from achieving their full performance potential. These include: (1) Although film is capable of responding to light striking the surface at a high angle of incidence, a high angle of incidence can prevent sufficient light from reaching sensor elements at the periphery of a CCD and result in reduced color definition, particularly when shooting with wide-angle lenses. (2) To achieve the resolutions required by the micron pitch of today's CCDs, the demands of optical design tend to result in the use of larger and heavier lenses.

Moreover, manufacturers of digital SLR camera systems have until now adopted the mounting systems used in their own respective 35mm film SLR cameras, making bodies and lenses produced by different manufacturers incompatible with one another.

In light of these circumstances, the new Four Thirds System standard was conceived to facilitate the design and development of digital SLR cameras and lenses that maximize the performance potential of digital imaging sensors, and provide users with product advantages such as compact size, handling ease, and enhanced functionality.

Benefits

The major benefit of Four Thirds System is that it allows the design of dedicated, high-performance digital camera lens systems that are more compact than 35mm film SLRcamera lens systems. The impact of the more compact lens size will be especially marked on telephoto lenses, making it possible to produce a Four Thirds System 300mm telephoto lens, for example, that offers performance equivalent to an approximately 600mm lens on a 35mm film SLR camera. In other words, it will be possible to offer the same angle of view in a lens that is only about one-half as long. The 4/3-type image sensor size will also allow the development of bright, high-performance zoom lenses that are more compact than those needed for use with image sensors the size of APS or 35mm film. By taking advantage of the more compact lens size, it will therefore be possible to develop lens systems that are much easier to handle than conventional 35mm film SLR camera lens systems. Furthermore, standardization of the lens mounting system will make it possible for consumers to photograph combining with bodies and lenses produced by different manufacturers, and enjoy a wider range of product selection.

Eastman Kodak Company
www.kodak.com