Soitec is the world’s leading supplier of engineered substrates for advanced microelectronics. The Group produces a wide range of advanced materials, especially silicon-on-insulator (SOI) wafers based on its Smart Cut™ technology — the first high-volume application for this proprietary technology. SOI is currently seen as the platform of the future, paving the way to higher-performance, faster, and more economical chips.
Soitec currently produces over 80% of SOI wafers. Headquartered at Bernin in France, with two high-volume production units on site, Soitec also has offices in the US, Japan, and Taiwan, and a new production site is in the process of customer qualification in Singapore. Two other business units : Picogiga International (Les Ulis) and Tracit Technologies (Bernin). Picogiga delivers advanced substrates solutions, including III-V epiwafers and gallium nitride (GaN) wafers, to the compound material world for the manufacture of high-frequency electronics and other optoelectronic devices. Tracit, on the other hand, provides thin-film layer transfer technologies used to manufacture engineered substrates for power ICs and microsystems, as well as generic circuit transfer technology, Smart Stacking™ for applications such as image sensors and 3D integration. Shares for the Soitec Group are listed on Euronext Paris.
More information is available at www.soitec.com
Soitec, Smart Cut and UNIBOND are trademarks of S.O.I.TEC Silicon On Insulator Technologies - Logo (c) S.O.I.TEC Silicon On Insulator Technologies - All rights reserved
